Coherent laser lift off microled4/27/2023 ![]() In contrast to miniLED´s, where the sapphire growth wafer might stay with the LED, microLED´s need to be released from the wafer and are only a few micrometres in thickness. Shrinking die sizes along with the ability to transfer large quantities of dies simultaneously from the growth wafers onto temporary carriers and final backplane substrates are still a big challenge.ĭeep-UV (DUV) excimer lasers, with their large available pulse energies and micron precision, are suitable candidates for facilitating these transfer steps in mass production. In the early stage of the product life cycle, technologies move fast, and many challenges are not solved today with the consequence that microLED manufacturing standards are not yet fixed. They will enhance the user experience and extend the range of applications for both super-large direct view displays as well as super-bright micro displays as demanded for AR/VR applications. ![]() ![]() MicroLED’s show great potential for future display applications. ![]()
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